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This work was performed on a standard thin-section poli-silicon solar cell (substrate thickness 100 μm) with a back surface field (BSF) contact. A commercial laser scribing system has been used to create a crack formation site on the upper surface of the cell. The crack's formation and propagation has been monitored using bright field and dark field scanning electron microscopy. Images of the crack formation and crack propagation within the solar cell have been obtained to allow for a detailed analysis of the crack formation and to attempt to establish the crack propagation mechanisms. In order to define the crack formation process, a high-resolution FE simulation of crack formation was performed.
Experimental results from SEM investigations demonstrate that the crack formation process is both heterogeneous and dependent on several factors including the energy level of the laser, the laser frequency, crack depth and the substrate residual stress. The crack propagation path is also found to be heterogeneous. The results from the FE simulation are found to be in good agreement with experimental data and allow for a better understanding of the crack formation process. In addition, the FE simulation results demonstrate that the crack can be initiated by the damage of a certain number of crystal grains or nucleation sites at the crack source site. The results also demonstrate that the crack growth is heterogeneous as it is influenced by the microstructures of the crack source site as well as intrinsic properties of the lattice such as the crystal grain size and distribution, the grain orientation and lattice orientation distribution.
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